ACE Group will participate in SEMICON Taiwan 2026 from September 2 to 4, 2026, showcasing the latest technologies and solutions in semiconductor testing, failure analysis, materials analysis, compound semiconductors, and advanced packaging.
We warmly welcome industry partners and professionals to visit our booths and explore opportunities for technology exchange and business collaboration.
Location and Booth
Venue: TaiNEX 1
ACE Solution: L0609 (4F)
TherMap Solutions – UK Pavilion: I3000 (1F)
Featured Solutions
- Automated SiPh & CPO Test
- FA / MA Thermal Analysis
- Compound Semiconductors
- Wafer & Advanced Packaging Non-destructive FA / MA Testing
Booth Tour
ACE Solution will offer Booth Tours to introduce our featured technologies, solutions, and applications.
Booth Tour spots are limited and will be arranged based on availability. We recommend registering in advance.
Booth Tour Registration:
.png){kind=small}
.png){kind=small}
.png){kind=small}
.png){kind=small}