AI computing power is accelerating the semiconductor industry toward a critical turning point—from “electronics” to “photonics.” As the demand for high bandwidth and low latency continues to surge, traditional electrical data transmission is approaching its physical limits. With its advantages of low power consumption and high integration, silicon photonics has become a key driving force for industry transformation.
In response to this trend, ACE Technology continues to focus on cutting-edge industry topics—how to achieve high-performance computing while ensuring effective thermal management and system stability. This seminar will focus on three key areas: high-speed communication, advanced packaging (such as CPO), and thermal imaging analysis. We will explore how to overcome thermal bottlenecks in high-density packaging structures through precise measurement and inspection technologies, and how forward-looking testing solutions can enhance product yield and system reliability.
In addition, this event will feature expert-led sessions offering insights into the latest technology trends and real-world applications, helping accelerate technology adoption and deepen industry implementation.
We sincerely invite professionals from academia, industry, and research communities to join us in exploring the key technological developments in optoelectronic integration and next-generation high-speed computing. We look forward to your participation!
Date: May 20, 2026 (Wed)
Time: 13:00–16:30
Registration: https://register.acesolution.com.tw/20260520_CommSiPhThermal_Seminar
Venue: No. 66, Shengyi 2nd Rd., Donghai Vil., Zhubei City, Hsinchu County 30261, Taiwan (R.O.C.)
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