Photo: From left to right, Marketing Manager Jenny Lin; President Steve Hsu; Sales Manager Jason Hsieh; CTO James Chang,
Technical Project Manager Bruce Cheng; Marketing Manager Mark Tsai.

【Taipei / Sept. 2, 2026】 As AI, HPC, and heterogeneous integration drive chips toward higher power, extreme data rates, and 3D packaging, the industry faces severe thermal, signal integrity, and yield challenges. Test system integration leader ACE Solution and its subsidiary ACE Systemtek debut today at SEMICON Taiwan 2026 (Taipei Nangang Exhibition Center, 4F, Booth L0609), showcasing over 20 years of test integration expertise.

To meet the high-bandwidth, low-power demands of AI data centers, ACE Solution presents a complete 1.6T Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) test portfolio. Partnering with Japan’s YONATA, ACE offers an automated alignment platform for wafer-level (O-WAT) and Known Good Die (KGD) testing to accelerate production calibration. Combined with Nexustest’s 1.6T/800G optical module test platform, Quantifi Photonics’ modular PXIe systems, and ACE’s proprietary control software, the setup provides a high-throughput, cost-effective commercial optical test line.

For 3D die stacking thermal issues, ACE Systemtek introduces advanced micro-area thermal resistance and heat flux analysis. In partnership with the UK's TherMap Solutions, its optical-thermal system non-destructively measures Thermal Boundary Resistance (TBR) across multi-layer interfaces without powering the device, speeding R&D thermal optimization. The platform also integrates US-based QFI’s high-end thermal imaging system, pinpointing micro-hotspots and electrical faults via true-temperature mapping. Strategic partner TherMap is also co-exhibiting at the UK Pavilion (1F, Booth I3000).

In advanced packaging and wafer inspection, ACE showcases the TZ-Series Terahertz system and EOTPR (Electro-Optical Terahertz Pulse Reflectometry). The TZ-Series penetrates complex materials to screen physical properties and uniformity in front-end processes, while EOTPR non-destructively locates micro-cracks and internal trace faults in advanced packaging and substrates, drastically shortening Failure Analysis (FA) cycles. For EV and green energy power devices, ACE’s lab also features Teradyne ETS test platforms with high-voltage/high-current and static/dynamic testing, collaborating with the local OSAT ecosystem to expedite mass production qualification.

ACE Group invites industry leaders and media across semiconductor, OSAT, optical communications, and IC design to visit the booth and discover how integrated testing overcomes process limits to seize AI market opportunities.

Event & Booth Info

•Event: SEMICON Taiwan 2026

•Dates: Sept. 2 (Wed) – Sept. 4 (Fri), 2026

•Venue: Taipei Nangang Exhibition Center, Hall 1

•Booths:

oACE Solution / ACE Systemtek: 4F, Booth L0609

oTherMap Solutions (UK Pavilion): 1F, Booth I3000

Photo: ACE Solution showcases semiconductor and silicon photonics 1.6T/800G integrated solutions.

Photo: TherMap Solutions’ CEO Roland B. Simon showcases thermoreflectance applications.